Singapore, September 25, 2026 — STATS ChipPAC today announced plans to expand its advanced packaging capabilities through a definitive licensing agreement for Singapore's A*STAR Institute of Microelectronics' (A*STAR IME) proprietary advanced packaging solutions for Co-Packaged Optics technologies. The partnership will accelerate STATS ChipPAC's advanced packaging technologies, manufacturing capabilities, and offerings to meet growing demand in artificial intelligence (AI), high-performance computing, data centers, and edge AI.
The partnership was announced at Innovate Together 2026, A*STAR's annual forum bringing together public research and industry to advance semiconductor technologies. The partnership was also highlighted by Minister for Trade and Industry (Energy and Industry), Dr. Tan See Leng, in his remarks at the event. To mark the occasion, STATS ChipPAC CEO Li Zheng and CTO Dr. IK Shim joined A*STAR Chief Executive Mr. Beh Kian Teik and Deputy Chief Executive (Innovation & Enterprise) Professor Yeo Yee Chia onstage.
This effort reflects the company's commitment to building an innovation-driven ecosystem in Singapore. By combining STATS ChipPAC's production expertise with A*STAR IME's advanced packaging capabilities in co-packaged optics technologies, the partnership strengthens STATS ChipPAC's ability to bridge research and manufacturing, improve manufacturability, and accelerate the transition of silicon photonics packaging from R&D into high-volume production. This supports the wider adoption of silicon photonics packaging, helps to foster technology development and shorten product cycles, and contributes to Singapore's position as a trusted hub for advanced semiconductor manufacturing.
"With demand for higher bandwidth and energy efficiency continuing to grow, co-packaged optics are increasingly important for the semiconductor industry's next phase," said Li Zheng, CEO of STATS ChipPAC. "We're investing heavily in these areas, and working with A*STAR IME builds upon a shared focus on applied innovation—bringing together STATS ChipPAC's strengths in advanced packaging and high-volume manufacturing with their expertise in silicon photonics to develop technologies that drive performance and efficiency across the industry."
"A*STAR IME bridges research and industry by bringing proven R&D capabilities to the semiconductor manufacturing ecosystem," said Terence Gan, Executive Director of A*STAR Institute of Microelectronics. "Our silicon photonics and advanced packaging technologies have been validated through manufacturing-grade processes, giving companies a clear pathway from R&D to volume production. A*STAR IME has worked with STATS ChipPAC over many years on advanced packaging projects, and this collaboration further strengthens that pathway by aligning our R&D capabilities with a trusted partner capable of scaling these technologies. Together, we are applying these strengths to accelerate technology adoption and strengthen Singapore's position in advanced semiconductor manufacturing."
The initiative marks a broader shift toward heterogeneous integration, photonics, and system-level innovation—key areas driving the next wave of semiconductor progress. It further reinforces STATS ChipPAC's leadership in advanced packaging and its role in enabling the technologies that define the industry's future.
