System-in-Package

Meet the demands for smaller, faster, and higher-performing electronics with STATS ChipPAC’s System-In-Package Solutions.

Simplified Solution. Powerful Powerformance.

System-in-Package combines various integrated circuits (ICs) and components into a unified system or modular sub-system. This design enables greater processing speeds, improved functionality, and a significant reduction in device size. When you consolidate multiple elements into one package, our SiP solutions streamline device performance and enable sophisticated designs in smaller form factors.

Benefits of System-In-Package

System-in-Package integrates multiple integrated circuits (ICs) and components into one unified system or modular sub-system. It enhances processing speeds, functionality, and system efficiency while significantly reducing the physical footprint of electronic devices.

With STATS ChipPac’s SiP, you can:

Enhance Performance

Bringing multiple components into a single package reduces signal loss and improves system efficiency.

Leverage Smaller Form Factor

SiP designs are ideal for applications where space constraints are critical, such as in wearables and mobile devices.

Ensure Energy Efficiency

Optimized system design reduces power consumption, extending device battery life.

Enjoy Flexible Configurations

Manufacturers can customize SiP layouts to meet specific design requirements.

Technologies Driving SiP
at STATS ChipPAC

STATS ChipPAC incorporates advanced technologies into its SiP solutions to address the needs of today’s complex systems:

Double-Sided Molding

We take a mainstream aReduces package size and connection paths, improving electrical performance and reducing resistance.pproach that integrates multiple components into a single package for improved efficiency and reduced complexity.

EMI Shielding

Uses back metallization to enhance thermal conductivity and mitigate electromagnetic interference (EMI).

Laser-Assisted Bonding (LAB)

Resolves challenges such as warpage, thermal stress, and CTE mismatch, thereby delivering reliable and durable packaging solutions.

Browse Our System-In-Package Technologies

FBGA

eWLB

QFN-FC

FCCSP

Explore All Technologies

Find out how else we can help your organization.

2.5/3D Integration

Integrate multiple components into a single compact package.

System-in-Package

Integrate multiple components into a single compact package.

Flip Chip Packaging Technology

Integrate multiple components into a single compact package.

Superior Memory Packaging

Integrate multiple components into a single compact package.
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