Key Applications

Built for real-world performance across five critical industries.

We develop application-specific packaging for the performance, reliability, and integration needs of automotive, computing, memory, AI, and energy systems. Built to match the demands of each industry—not the other way around.

Industry Applications

Real-world use cases across automotive, AI, compute, and beyond.

Automotive

Leading the future of mobility with smart, sustainable vehicles. Advanced ADAS, high-performance solutions, and an enduring commitment to zero-defect quality.
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Computing

Unlocking next-generation computing power with innovative 2.5D & flip chip packaging. Delivering performance and efficiency for leading manufacturers.
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Memory

Reimagining data security with advanced memory solutions. 3D NAND/SSD, innovative stacking, and a complete silver WB portfolio. Trusted by top OEMs worldwide.
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AI Edge

Shaping the intelligent edge with ultra-compact, high-performance AI solutions. Expertise in RF design, 5G testing, and high-density packaging capabilities.
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Power & Energy

Building a greener future with customizable power solutions (SiC/GaN, DrMOS, PoL, IBC, Si PMICs, etc.). From everyday devices to advanced electronics.
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