Test Solutions

Performance proven through test.

STATS ChipPAC provides customers with a full suite of test platforms and engineering services for mixed-signal, Radio Frequency (RF), analog, and high-performance digital semiconductor devices. Turnkey test capabilities span wafer bump, probe, final test, post-test, and system-level test, delivering the lowest cost of test with high throughput and faster time-to-market.

Key Features

Our global manufacturing network brings together proven test capabilities and operational efficiency to achieve the lowest cost of test with the highest possible throughput. Early involvement in product development allows us to provide the expertise and guidance needed for a rapid, predictable production ramp.

Front-End Development

Test development and consultation services

Wafer-Level Testing

Wafer testing for bumped wafers and Known Good Die (KGD), supporting stacked-die assembly in a single package

Post-Test Services

Optimized post-test services supporting rapid delivery of final products to end customers

Final Testing

Advanced test technology and automated process control for simple and advanced packages, limiting yield loss to hard silicon failures

System-Level Testing

Comprehensive system-level testing for high throughput and the lowest cost of test

Testing Services

Test Platform
Wafer Sort
Test Development
RF Test
Mixed-Signal Test
Memory / 3D Test
High-End Digital Test
Strip Test
Final Test
Post Test
ITMS

Reliability Tests & Failure Analysis Services

Our capabilities span environmental, life, and board-level reliability testing, supported by a full range of failure analysis services.

Reliability Testing

Environmental Reliability Tests
Warpage
Drop Test (Board Level)
TCT (Board Level)
Additional Reliability Tests
Solder
SHT
HAST
Reflow

Failure Analysis

Explore Solutions

Turnkey Solutions

Design Solutions

Packaging Solutions

Test Solutions

Copyright © 2026, STATS ChipPAC Management Pte. Ltd.