Design Solutions

Performance starts with the right design.

As semiconductor packages become smaller, faster, and more complex, fitting greater performance into less space creates new challenges for long-term reliability and package stress. Achieving the optimal package design requires in-depth analysis of key package measurements and simulation.

Key Features

STATS ChipPAC works closely with customers on die and package design to meet demanding targets for performance, quality, cycle time, and cost. Our full-service Package Design Centers provide the expertise to determine the optimal package for each end product.

Design Services

Customer-Centric
Designers
Mobile Design
Capability
State-of-the-Art
Design Tools
Integration of Customer-
Supplied Designs
Project Data
Management

Characterization Services

Thermal Analysis

Mold Flow Analysis

Mechanical Analysis

Electrical Analysis

Proven Experience

Our design team brings extensive experience across mobile, networking, computing, consumer, and automotive markets, with expertise spanning laminate, leadframe, and wafer-level package designs. This includes single-die, multi-die, Package-on-Package (PoP), Integrated Passive Devices (IPD), and advanced System-in-Package (SiP), with the experience to deliver complex designs that meet or exceed assembly and cost targets.

Collaborative Design

Working closely with customers through co-design during integrated circuit (IC) development, our Design and Characterization Team helps ensure the package meets performance requirements from the start. This collaborative approach creates the right environment for optimal performance across designs ranging from single-chip devices to complex System-in-Package (SiP).

Design Process

Each design is managed through our Product Data Management system, bringing together design and characterization expertise with customer requirements early in the process. New designs undergo feasibility review against factory, supplier, and customer requirements, while close collaboration throughout the process helps optimize the package for cost, assembly, and function.

Design Tools

  • Cadence SiP / APD
  • Autodesk: AutoCAD
  • DownStream CAM350
  • Internally developed support tools

Explore Solutions

Turnkey Solutions

Design Solutions

Packaging Solutions

Test Solutions

How Our Services Changed the World

Proven Experience

Our expert design team serves mobile, networking, computing, consumer, and automotive markets. We specialise in laminate, leadframe, and wafer-level designs, including PoP, IPD, and advanced SiP solutions, delivering cost-effective and reliable designs to our clients

Design for Performance

Smarter package design for advanced devices. Simulation-driven insights to optimize reliability, performance, and cost.

Design Process

Full-spectrum packaging capabilities, including FIWLP, FOWLP, and TSV-based platforms. Built to enable complex, compact systems without compromising speed, quality, or cost.
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Design Tool Sets

Comprehensive test solutions across RF, analog, mixed-signal, and digital devices. High-throughput platforms engineered to reduce cost, accelerate ramp, and ensure quality at scale.
Proven Experience
Design for Performance
Design Process
Design Tool Sets
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