With a legacy of innovation and a global presence, we deliver end-to-end solutions across package integration design, R&D, wafer bumping, assembly, and final testing. Our technologies, ranging from wafer-level packaging and flip chip to System-in-Package, enable the mobile, automotive, and industrial devices that power today’s connected world.

We operate from advanced R&D centers in Singapore and Korea, collaborating closely with customers worldwide. By combining deep technical expertise with efficient, high-scale manufacturing, STATS ChipPAC delivers the precision, performance, and reliability modern applications demand.