Advanced packaging for the 5G era.
High-frequency, high-speed, low-latency, and multi-channel demands are reshaping IC packaging in the 5G era. STATS ChipPAC offers a full suite of advanced packaging and testing solutions, including 2.5D/3D, wafer-level packaging, and system-in-package (SiP), supported by collaborative design, simulation, and automated quality control.
Our integration capabilities include high-density SMT, laser-assisted bonding (LAB), double-sided molding SiP, and EMI shielding, enabling scalable production for RF front-end modules, millimeter-wave antennae AiP, and other high-performance 5G components.
