STATS ChipPAC supports advanced power semiconductors and analog devices for modern energy, communication, and compute systems. We're expanding capacity and co-developing power modules with industry leaders in the energy and infrastructure sectors.

Production covers Kelvin formats like TOLL, TO-263-7, and TO-247-4; bottom, top, and dual-sided cooling; and advanced interconnects including silver sintering and DBC—built for thermal efficiency, electrical reliability, and high-volume scalability.