Global Microsystems Integration Leader

30+
years of semiconductor backend manufacturing expertise
20+
operational locations worldwide

Your Trusted Partner for a More Interconnected Future

STATS ChipPAC is the world’s leading integrated circuit manufacturing and technology services provider. We offer a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probing, wafer bumping, package assembly, final testing, and drop shipment to vendors around the world.
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Applications

Advanced packaging designed for the systems shaping tomorrow:

Automotive

Computing

Memory

AI Edge

Power & Energy

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Future-Proof
Technologies

Built to keep the world running smarter and faster.
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Wirebond Packaging

Streamline semiconductor assembly with cost-effective, flexible wirebond interconnections.

Flip Chip Packaging

Achieve high-density interconnects and improved electrical and thermal performance.

Wafer Bumping

Enhance miniaturisation and power distribution with wafer bumping to enable direct attachment for advanced packaging solutions.

Wafer Level Packaging

Deliver powerful, multi-functional devices in smaller, thinner, and cost-efficient packages.

System-in-Package

Integrate multiple circuits into a compact system to boost performance, functionality, and processing speeds.

MEMS and Sensors Packaging

Enable next-gen smart devices with MEMS and sensor packaging, designed for diverse industries.

2.5 / 3D Packaging

Maximise performance by stacking and interconnecting components.

Turnkey Microsystems Solutions

STATS ChipPAC offers end-to-end microsystem solutions, from design to test. With expertise in RF SiP design, wafer-level processing, and system-level testing, we provide product-tailored solutions that minimize time-to-market and ensure optimal performance for diverse applications.

Turnkey Services

Design Characterization

Wafer Bumping

Packaging

Testing

Reliability Testing &
Failure Analysis

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Our Commitment to Planet, People, and Principles

Building a smarter, more sustainable future through measurable goals and responsible innovation.
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Environmental Goals

Achieving net-zero emissions by 2050, with milestones including 90% renewable energy use by 2030 and <1% landfill rates by 2024.

Social Responsibility

Certified by RBA VAP, we prioritise health, safety, and ethical practices.

Governance Excellence

ISO14064-1 and ISO45001 certifications reflect our commitment to transparency and accountability in all operations.

Careers at STATS ChipPAC

With roles across multiple disciplines, we empower our employees to thrive in a collaborative environment. We value diverse perspectives and offer our employees the chance to contribute to projects that impact industries worldwide.
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Global Reach, Local Expertise

Explore our worldwide locations and connect with the teams closest to you.
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