Connecting Technologies
Advanced IC back-end manufacturing technology and services for a smarter world.

Your Trusted Partner for a More Interconnected Future

STATS ChipPAC is the world’s leading integrated circuit manufacturing and technology services provider. We offer a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probing, wafer bumping, package assembly, final testing, and drop shipment to vendors around the world.

TECHNOLOGY & SERVICES

Technology That Powers What's Next

KEY APPLICATIONS

Built for the Most Demanding Applications

CONTACT US

Global Presence, Local Support

Connect with our regional offices for inquiries on sales, partnerships, or support.