About
About
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Applications
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Technology & Services
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Wafer Probing
Wafer Bumping
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Advanced 2.5D / 3D Packaging Solutions
Ultra High-Density Advanced SiP Technology
Ultra-Thin Wafer Level Packaging Technology
High-Performance Flip Chip Technology
Superior Memory Packaging Technology
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Sustainability
Green Manufacturing
Conflict-Free Mineral Policy
ESG
Technology & Solutions
Sustainability
Contact Us
Worldwide Locations
Strategically positioned across Asia, Europe, and North America to
support global innovation.
STATS ChipPAC Korea
STATS ChipPAC Korea
Incheon, South Korea
Certifications
ISO 9001 SCK
|
IATF 16949 SCK
|
ISO 14001 SCK
|
ISO 45001 SCK
|
ISO 22301 SCK
|
ISO 27001 SCK
|
ESD S20.20 SCK
|
Samsung Eco Partner
|
RBA SCK
|
ISO 14064-1:2018 (GHG Emission Review)
STATS ChipPAC Korea +
STATS ChipPAC Korea +
Incheon, South Korea
Certifications
ISO 9001 SCK
|
IATF 16949 SCK
|
ISO 14001 SCK
|
ISO 45001 SCK
|
ISO 22301 SCK
|
ISO 27001 SCK
|
ESD S20.20 SCK
|
Samsung Eco Partner
|
RBA SCK
|
ISO 14064-1:2018 (GHG Emission Review)
STATS ChipPAC Singapore
STATS ChipPAC Singapore
Singapore
Certifications
ISO 9001 SCK
|
IATF 16949 SCK
|
ISO 14001 SCK
|
ISO 45001 SCK
|
ISO 22301 SCK
|
ISO 27001 SCK
|
ESD S20.20 SCK
|
Samsung Eco Partner
|
RBA SCK
|
ISO 14064-1:2018 (GHG Emission Review)
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