Memory | STATS ChipPAC

Driving what memory demands.

With over 20 years of experience in memory packaging, STATS ChipPAC supports stable, high-yield production for NAND Flash and DRAM. We partner with the world’s leading memory manufacturers to accelerate product development and deliver reliable, high-volume solutions for next-generation storage systems.

Packaging & Technology Portfolio

Deliver high-quality products at a better value with our technologies.

Packaging & Technology Portfolio

Where proven solutions meet evolving demands.

Electrification

Si IGBT, SiC MOSFET, GaN Switch

SOT / SOP

TO

TOLL

Memory

NAND Flash, DRAM, …

FBGA

WBBGA

3D NAND

Core Capabilities

Vertical die-stack technology with high Si stacking structure

Deep expertise in Flash and DRAM products

Ultra-thin chip processing at industry-leading precision

Partnerships with the world’s top three memory manufacturers

Application Advantages

Experienced in Flash & DRAM Product

Die-Stack Technology Leader

Complete Silver WB Portfolio

Serving Top 3 Memory OEMs

Facilities in Singapore & S. Korea

Explore Key Applications

Automotive

Computing

Memory

AI Edge

Power & Energy