Wirebond Packaging

Proven by scale and longevity.

Wire bonding forms electrical interconnections from chip to substrate, substrate to substrate, or substrate to package. Known for its flexibility and cost efficiency, it remains one of the most widely used interconnect technologies across semiconductor packaging.

Inside the Technology

  • Wire bond interconnect options using gold, silver, copper, and other metal wires across multiple packaging approaches
  • Copper wire as a preferred, cost-effective alternative to gold in wire bond packaging
  • Comparable electrical characteristics and performance between copper and gold wire
  • Lower wire resistance supporting improved device performance in resistance-sensitive applications

Technical Highlights

Packaging types including discrete devices, QFN, DFN, QFP, WB-BGA, and WB-LGA
Wire materials including aluminum, gold, silver, copper, palladium-coated copper, and gold-palladium-coated copper
Compatibility with thin substrates, leadframes, and MIS substrates
Mature HVM experience with shipments exceeding hundreds of billions of units
Mass production solutions applied across power devices, MEMS and sensors, memory, mobile communications, automotive, and related applications

Applications

ADAS
AI
Data Centers
Blockchain
ADAS
AI
Data Centers
Blockchain

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Wirebond Packaging

Reliable, cost-effective interconnects trusted in high-volume manufacturing

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