MEMS & Sensors Packaging

Where physical and
digital meet.

MEMS and Sensors are increasingly central to smart, connected devices that require precise sensing, communication, and control. Their smaller footprint, thinner profile, and high functional integration make advanced packaging essential across applications in communications, consumer electronics, medical devices, industrial systems, and automotive platforms.

Inside the Technology

  • Turnkey support including package co-design, simulation, BOM qualification, assembly, quality assurance, and in-house testing
  • Manufacturing and test capabilities built around rigorous process control and integrated MEMS workflows
  • Compact, high-integration designs that enable smaller form factors and strong system performance for MEMS and sensor modules
  • Cost-efficient solutions developed to meet critical size, performance, and cost requirements

Technical Highlights

Flip-chip formats covering fcCSP, fcBGA, FCoL, C2W, 3DIC, and other configurations
Large-size fcBGA packages with multiple thermal management options
AiP solutions in embedded-antenna SiP or fcBGA formats on laminate substrates
FCoL (Flip Chip-on-Leadframe) solutions using QFN, TSOT, and similar formats to enable copper-pillar or gold-bump flip-chip packages

Applications

Automotive
Pressure Sensors
Printer ICs
Optical Sensors
LiDAR
Microphone
Sensors
RF MEMS
Temperature &
Humidity Sensors
IoT Devices
Fingerprint
Sensors

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