Packaging breadth. Advanced integration.
STATS ChipPAC offers a comprehensive portfolio spanning lead-frame and substrate-based packaging, flip-chip interconnects, and advanced wafer-level technologies. A unique advantage is the breadth of our wafer-level technology platform, including Fan-In Wafer-Level Packaging (FIWLP), Fan-Out Wafer-Level Packaging (FOWLP), Integrated Passive Devices (IPD), and Through-Silicon Via (TSV)-based interposer solutions. These technologies address growing demand for next-generation high-density devices, enabling greater integration, enhanced functionality, and smaller form factors.
Working closely with customers across chip and package design, we meet demanding targets for performance, quality, turnaround time, and cost. This comprehensive wafer-level platform also supports flexible integration of advanced 2.5D and 3D solutions.
