Singapore, September 1, 2026 — STATS ChipPAC is deepening its commitment to advanced packaging as accelerating investment in artificial intelligence reshapes the semiconductor value chain. As hyperscalers, memory leaders and outsourced semiconductor assembly and test (OSAT) providers scale capacity together, advanced packaging has moved from a back-end step to a strategic enabler of AI, data center and high-performance computing (HPC) systems.

Demand reflects this shift. Driven by the rapid advance of AI, HPC and high-bandwidth memory (HBM), demand for advanced packaging and test solutions has continued to strengthen through 2026, and STATS ChipPAC's Singapore and South Korea facilities have been operating at consistently high levels of utilization — reflecting sustained customer confidence and the growing strategic importance of advanced packaging. With HBM, 2.5D/3D integration and chiplet architectures driving significant new demand, capacity has become one of the industry's most closely watched constraints, and OSATs have emerged as critical enablers of AI infrastructure.

Against this backdrop, STATS ChipPAC continues to invest in advanced packaging technology, capacity, materials and talent to support its customers' most demanding AI, data center and HPC roadmaps. The company is managing industry-wide dynamics carefully, working to keep the quality, reliability and technology its customers depend on sustainable over the long term.

STATS ChipPAC remains committed to supporting customer success. A healthy, resilient supply chain, the company believes, is built on partnerships in which value, investment and long-term commitment are shared by all parties — and it views the current cycle as an opportunity to capture the opportunities of the AI era together with its customers, while jointly addressing the challenges, to build a stronger, more sustainable semiconductor ecosystem worldwide.