About
About
Culture & Values
Leadership Team
Worldwide Locations
Ethics & Compliance
Careers
Applications
Applications
Automotive
Computing
Memory
AI Edge
Power & Energy
Technology & Solutions
Technology
Wirebond Packaging
Flip Chip Packaging
Wafer Bumping
Wafer Level Packaging
System-in-Package
MEMS & Sensors Packaging
2.5/3D Packaging
Solutions
Turnkey Solutions
Design Solutions
Packaging Solutions
Test Solutions
ESG
ESG
Green Manufacturing
Responsible Sourcing
Newsroom
Contact Us
Worldwide Locations
Strategically positioned across Asia, Europe, and North America to
support global innovation.
STATS ChipPAC Korea
STATS ChipPAC Korea +
South Korea
STATS ChipPAC Global HQ
STATS ChipPAC Singapore
Singapore
STATS ChipPAC Korea
STATS ChipPAC Korea
Incheon, South Korea
Certifications
ISO 9001 SCK
|
IATF 16949 SCK
|
ISO 14001 SCK
|
ISO 45001 SCK
|
ISO 22301 SCK
|
ISO 27001 SCK
|
ESD S20.20 SCK
|
Samsung Eco Partner
|
RBA SCK
|
ISO 14064-1:2018 (GHG Emission Review)
STATS ChipPAC Korea +
STATS ChipPAC Korea +
Incheon, South Korea
Certifications
ISO 9001 SCK
|
IATF 16949 SCK
|
ISO 14001 SCK
|
ISO 45001 SCK
|
ISO 22301 SCK
|
ISO 27001 SCK
|
ESD S20.20 SCK
|
Samsung Eco Partner
|
RBA SCK
|
ISO 14064-1:2018 (GHG Emission Review)
STATS ChipPAC Singapore
STATS ChipPAC Singapore
Singapore
Certifications
ISO 9001 SCK
|
IATF 16949 SCK
|
ISO 14001 SCK
|
ISO 45001 SCK
|
ISO 22301 SCK
|
ISO 27001 SCK
|
ESD S20.20 SCK
|
Samsung Eco Partner
|
RBA SCK
|
ISO 14064-1:2018 (GHG Emission Review)
