As semiconductor content in vehicles grows, reliable backend solutions are more essential than ever. STATS ChipPAC delivers cost-effective packaging for automotive MCUs and in-vehicle electronics, including QFP, QFN, copper wire BGA, flip-chip, SiP, and fan-out WLP.

Our flip-chip solutions deliver L/S down to 10μm, bump pitches of 70μm, and eWLB up to 12×12mm. We also support 1–3 layer RDL and high-volume production of power module substrates and interconnects like DBC/DBA/AMB, aluminum wire, copper clips, and silver sintering—helping drive smarter, cleaner energy on the road.