Innovating Smart Device Integration

MEMS and Sensor Packaging offers compact designs, reduced profiles, and integrated functionalities to support advanced applications in communications, consumer electronics, medical, industrial, and automotive sectors.

STATS ChipPac provides MEMS and Sensor Packaging solutions through a robust technology portfolio and a dedicated MEMS team. Our services include co-design, Bill of Materials (BOM) qualification, assembly, and in-house testing, giving you peace of mind that the solutions you’re using are at par with industry standards.

Benefits of MEMS and Sensor Packaging

Our MEMS and Sensor Packaging solutions are designed to address the needs of modern applications:

Compact Designs

Facilitate space-constrained applications with smaller form factors that do not compromise functionality.

Optimized Performance

Improve sensing accuracy and operational efficiency across a range of devices and industries.

Application Versatility

Adaptable designs meet the requirements of diverse industries, including automotive, healthcare, and IoT.

Comprehensive Testing

In-house testing ensures precision and reliability for MEMS and sensor applications.

Cost-Effective Solutions

Achieve lower production costs through streamlined integration and advanced manufacturing techniques.

Browse Our System-In-Package Technologies

Explore All Technologies

Find out how else we can help your organization.

2.5/3D Integration

Integrate multiple components into a single compact package.

System-in-Package

Integrate multiple components into a single compact package.

Flip Chip PackagingTechnology

Integrate multiple components into a single compact package.

Superior Memory Packaging

Integrate multiple components into a single compact package.