Superb Miniaturization. Top-Level Performance.

Flip Chip packaging is a modern approach to semiconductor connectivity that replaces traditional wirebonding by attaching the silicon die directly to the substrate through solder bumps. At STATS ChipPac, we offer a broad range of Flip Chip solutions to cater to the diverse needs of the industry. Our portfolio spans from single-die packages with integrated passive components to complex 3D packaging modules, providing options for both low-cost manufacturing and sophisticated, high-functionality systems.

Benefits:

Dense Interconnects

Faster Signal Transmission

Superior Electrical and Thermal Performance

Ensure Energy Efficiency

Enjoy Flexible Configurations

Other Solutions

Explore All Technologies

Find out how else we can help your organization.

2.5/3D Integration

Integrate multiple components into a single compact package.

System-in-Package

Integrate multiple components into a single compact package.

Flip Chip Packaging Technology

Integrate multiple components into a single compact package.

Superior Memory Packaging

Integrate multiple components into a single compact package.