Singapore, October 30, 2025 — STATS ChipPAC hosted its inaugural Advanced Packaging Developer Conference in Singapore, attracting nearly 700 registrations and bringing together approximately 450 on-site attendees from across the global semiconductor ecosystem. The event provided a platform for industry leaders, researchers, and developers to exchange insights and explore the future of advanced packaging technologies.
The conference featured in-depth technical discussions spanning core topics such as AI and heterogeneous integration, 3D and hybrid bonding, advanced bonding, co-packaged optics, and panel-level packaging, as well as other key areas including design and simulation, thermal management, automotive IC packaging, materials, and advanced testing. Discussions addressed both the challenges and opportunities shaping technology development, with a strong focus on accelerating innovation and fostering cross-disciplinary collaboration. Across 30 breakout sessions, speakers and moderators engaged full rooms of participants in active dialogue, reflecting the industry’s enthusiasm for ideation and technical exchange.
The flagship event drew significant interest from the international semiconductor community. Distinguished guests from the Singapore Semiconductor Industry Association (SSIA) and the Institute of Microelectronics (IME), A*STAR, joined the conference. STATS ChipPAC Chief Technology Officer Dr. IK Shim delivered the opening keynote, emphasizing the company’s vision for partnership and progress across the industry: “Together, we’re advancing the next era of semiconductor innovation.”
Dr. Boping Wu, VP and GM of Technology Services BU, and Dr. Nokibul Islam, Senior Director of Business Development, also presented, outlining STATS ChipPAC’s technology service platform and advanced packaging technology roadmap, and offering valuable insights to inspire continued collaboration.
A key highlight was the launch of the Advanced Packaging Developer Platform, a new initiative designed to support developers across process, materials, equipment, design, and testing domains. The platform aims to break down industry silos, drive cross-sector progress, and strengthen the engineering foundation for next-generation IC packaging and testing.
Attendees praised the conference for bringing together diverse perspectives, strengthening alignment across the semiconductor value chain, and sparking new ways to facilitate more resilient, agile, and mutually beneficial partnerships. Building on the success of its inaugural edition, STATS ChipPAC plans to continue expanding the Advanced Packaging Developer Conference as a key platform for industry dialogue and collaboration.
