Design & Characterisation Services

Engineers are looking for ways to fit powerful components into smaller spaces without causing issues. We're here to address that.

Fit-for-Purpose Designs without Compromising Functionality

As semiconductor packages become smaller, faster, and more powerful, STATS ChipPAC's global characterisation teams in China, Singapore, South Korea, and the U.S. provide advanced analysis and simulation services to deliver reliable, high-performance, and cost-effective designs that adhere to industry standards.

Topnotch Designs that 
Provide Exceptional Value

STATS ChipPac partners with clients to deliver top-quality designs that offer the best value for your buck. 
Here's what we can do for you.

Design Services

We deliver bespoke design solutions that meet your specific requirements.

Customer-Centric Designers

Mobile Design Capability

State-of-the-Art Design Tools

Integration of Customer-Supplied Designs

Project data management

Characterisation Services

Our team provides characterisation services that ensure reliable performance.

Thermal Analysis

Mould Flow Analysis

Mechanical Analysis

Electrical Analysis

Explore All Technologies

Find out how else we can help your organization.

2.5/3D Integration

Integrate multiple components into a single compact package.

System-in-Package

Integrate multiple components into a single compact package.

Flip Chip Packaging Technology

Integrate multiple components into a single compact package.

Superior Memory Packaging

Integrate multiple components into a single compact package.
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