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High-Performance Packaging Designed for 5G Applications

The transition to 5G technology brings new challenges to integrated circuit packaging, driven by the need for high-frequency performance, faster speeds, low latency, and multi-channel capabilities. STATS ChipPAC offers industry-leading packaging and testing solutions designed to meet these demands to ensure top-tier quality for various 5G applications.

Baseband

RF

Infrastructure

Our Advantages

  • RF Co-Design & Simulation
  • High-Speed EMI Shielding
  • RFFE SiP & 5G AiP Toolbox
  • Low-Dk/Df BOM Selection
  • Turnkey 5G Testing Service

Leading High-Density
Integration Technologies

2.5D and 3D Packaging

We provide leading-edge high-density integration solutions for complex, next-generation designs.

Wafer-Level Packaging

Our advanced processes deliver compact, cost-efficient solutions while maintaining superior quality and performance.

System-in-Package (SiP)

We excel in integrating multiple components into streamlined packages, enabling more efficient designs and faster time-to-market.

Technologies That Drive Your Innovation

Deliver high-quality products at a better value with our technologies.

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Key Applications

Automotive

Computing

Memory

AI Edge

Power & Energy

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