STATS ChipPAC Senior Management
Dr. Han Byung Joon
President and Chief Executive Officer
Dr. Han Byung Joon is currently the President and Chief Executive Officer of the Company. He joined us in 1999 as our Chief Technology Officer. He is also responsible for Advanced Technology Marketing and is the Head of Asia Sales for our Company. Prior to joining us, Dr. Han worked at Anam Semiconductor, AT&T Bell Labs and IBM. He received his Doctorate from Columbia University and attended Harvard Business School's Executive Advanced Management Program.
Woo Kwek Kiong
Chief Financial Officer
Mr. Woo Kwek Kiong joined us as our Chief Financial Officer in August 2015. Prior to joining us, he was Chief Financial Officer at Advanpack Solutions Pte Ltd, a subsidiary of Jiangsu Changjiang Electronics Technology, with overall responsibility for the financial and accounting procedures in compliance with the standard and regulatory requirements as well as actively involved in its strategic business development. Prior to that, he was the Chief Financial Officer of ASTI Holdings, a leading provider of semiconductor manufacturing services, listed on the Singapore Stock Exchange, and had also held senior financial positions at various companies. He started his career with KPMG
Mr Woo holds a Bachelor of Accountancy with Second-class Upper Division Honours from National University of Singapore and also a member of the Institute of Singapore Chartered Accountants.
Executive Vice President and Chief Sales Officer
Mr. Hal Lasky joined us as Chief Sales Officer in March 2008. Prior to joining us, Mr. Lasky spent 24 years at IBM where he held a number of key leadership positions, most recently as Vice President of Worldwide Semiconductor Sales for IBM's Global Engineering Solutions group with responsibility for worldwide semiconductor revenue, sales strategy and strategic relationships with clients in the consumer, communications and information techology markets. Prior to that, he held various senior management positions in IBM's Systems and Technology Group, Microelectronics Business Line and Interconnect Products Business Line. Mr. Lasky holds a Bachelor of Science in Ceramic Engineering from Rutgers University and a Master in Materials Science and Engineering from Columbia University. He is also a graduate of the IBM Client Executive Program at Harvard Business School.
Senior Vice President, Operations Management and Strategy
Mr. Cindy Palar has been Senior Vice President since October 2013. He joined our company in 1999 and has held various leadership positions including Vice President of Demand and Capacity Management before being appointed to his current position as head of Operations Management and Strategy in January 2015. Prior to joining us, Mr. Palar was with National Semiconductor Corporation for 4 years where he held various technical and managerial positions. He graduated with a Bachelor of Science (Mechanical Engineering) from California State University and also holds a Master of Business Administration (Finance, Investment and Banking) from the University Of Wisconsin.
Shim Il Kwon
Senior Vice President and Chief Technology Officer
Mr. Shim Il Kwon has been Senior Vice President and Chief Technology Officer since August 2015. He joined our company in 2000 and has held several technology leadership positions including Vice President, Head of Corporate Technology Innovation and Vice President, Head of Research and Development before being appointed as Senior Vice President. Prior to joining us, Mr. Shim was with Amkor Technology in Korea and the U.S. where he held various product development and management positions in the Advanced Product Development Group. Mr. Shim holds more than 150 patents granted by the U.S. Patent and Trademark Office. He received both his Bachelor of Science and Master of Science degrees from Chungnam National University in Korea. Mr. Shim also studied doctoral programs in Material Science and Engineering from Korea Advanced Institute of Science and Technology (KAIST) in Seoul, Korea.