1. STATS ChipPAC CompaniesSelect

    1. STATS ChipPAC Companies

      1. STATS ChipPAC Shanghai (China)
      2. STATS ChipPAC Malaysia
      3. STATS ChipPAC Korea
      4. STATS ChipPAC Singapore
      5. STATS ChipPAC Taiwan
      6. STATS ChipPAC Thailand
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fcCuBE (TM)

Flip Chip with Cu Column, BOL and Enhanced Processes -- a High Density, ELK Stress Resistant, Reduced Cost, Pb-free solution
Market Solutions

Working with a partner who can deliver semiconductor solutions that satisfy market demand is a critical success factor

News Center

  • STATS ChipPAC Reports First Quarter 2012 Results.  
  • STATS ChipPAC Appoints Pasquale Pistorio as Director.  
  • STATS ChipPAC Schedules First Quarter 2012 Results Conference Call.  
  • STATS ChipPAC Receives Intel’s Preferred Quality Supplier Award.  
  • STATS ChipPAC Provides Updated Outlook for First Quarter 2012.  
More news...

Resources

  • STATS ChipPAC's Steve Anderson talks with 3DInCites about 3D packaging at IMAPS Device Packaging Conference. Watch the video...
  • Through Silicon Via (TSV) -- an important element in 2.5D and 3D packaging
  • fcCuBE: a High Density, ELK Stress Resistant, Reduced Cost, Pb-free flip chip solution!
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STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions.
A trusted partner and supplier to leading semiconductor companies worldwide, STATS ChipPAC provides fully integrated,
multi-site, end-to-end packaging and testing solutions that bring products to the market faster.
© 2012 STATS ChipPAC Ltd.