a significant paradigm shift from conventional wafer level manufacturing with unprecedented flexibility and cost advantages
flip chip with Cu Column, BOL and Enhanced Processes -- A proven, low cost, high performance flip chip solution
STATS ChipPAC Pte. Ltd. is a leading service provider of advanced semiconductor packaging design, assembly, test and distribution solutions.
A trusted partner and supplier to leading semiconductor companies worldwide, STATS ChipPAC provides fully integrated,
multi-site, end-to-end packaging and testing solutions that bring products to the market faster.
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