1. STATS ChipPAC CompaniesSelect

    1. STATS ChipPAC Companies

      1. STATS ChipPAC Shanghai (China)
      2. STATS ChipPAC Korea
      3. STATS ChipPAC Singapore
      4. STATS ChipPAC Taiwan
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FlexLine™

a significant paradigm shift from conventional wafer level manufacturing with unprecedented flexibility and cost advantages
fcCuBE™

flip chip with Cu Column, BOL and Enhanced Processes -- A proven, low cost, high performance flip chip solution

News Center

  • Cavendish Kinetics Adopts STATS ChipPAC’s Wafer Level Technology for its SmarTune RF MEMS Tuners.  
  • STATS ChipPAC Reports Fourth Quarter and Full Year 2014 Results.  
  • STATS ChipPAC Schedules Fourth Quarter and Full Year 2014 Results Conference Call.  
  • STATS ChipPAC Announces Plan to Relocate China Manufacturing Operation.  
  • STATS ChipPAC Receives Top 20 Semiconductor Manufacturing Patent Ranking for Fourth Consecutive Year.  
More news...

Resources

  • Document Library - view datasheets, white papers & other technical resources
  • VIDEO: Moore's Law in Advanced Packaging from STATS ChipPAC
  • VIDEO: The transforming role of OSATs and how STATS ChipPAC has positioned itself to take on these changing times.
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STATS ChipPAC Ltd. is a leading service provider of advanced semiconductor packaging design, assembly, test and distribution solutions.
A trusted partner and supplier to leading semiconductor companies worldwide, STATS ChipPAC provides fully integrated,
multi-site, end-to-end packaging and testing solutions that bring products to the market faster.
© 2015 STATS ChipPAC Ltd.