In addition, STATS ChipPAC offers an innovative, low cost flip chip technology called “fcCuBE.” fcCuBE is a low cost, high performance advanced flip chip packaging technology that features copper (Cu) column bumps, Bond-on-Lead (BOL) interconnection and other enhanced assembly processes. The name says it all: flip chip with Cu Column, BOL and Enhanced Processes. fcCuBE® technology is available across a wide range of platforms.Since receiving its first fcCuBE-related patent in 2006 on the innovative BOL process, STATS ChipPAC has invested heavily over the years in developing this transformative technology into a compelling flip chip solution a wide cross section of end products in the low to high end mobile market, as well as mid to high end consumer and cloud computing markets.
The advantages of fcCuBE are driving wide customer adoption from cost sensitive markets such as mobile and consumer to networking and cloud computing where increased routing density and performance are imperative. fcCuBE’s unique BOL interconnect structure provides scalability to very fine bump pitches and high I/O while alleviating stress-related chip to package interaction (CPI), a common phenomenon associated with lead free and copper column bump structures. This is particularly important for mid- to high-end networking and consumer applications.