Dr. Lee Choon Heung
Dr. Lee Choon Heung joined us in September 2018. He currently serves as Chief Technical Officer. His is also the Chief Technical Officer of Jiangsu Changjiang Electronics Technology Co Ltd. Prior to joining us, he was the Vice President for Advanced Packaging of Lam Research from March 2016 to September 2018. Dr. Lee served as the Chief Technology Officer of Amkor Technology, Inc from December 2013 to November 2015. Dr. Lee also served as an Executive Vice President for Worldwide Manufacturing Operations at Amkor Technology, Inc and President of Amkor Technology Korea from February 2015 to November 2015. He joined Amkor in 1996 and has served in various senior management positions, including Corporate Vice President of Business and Technology Management. Dr. Lee also has written various research papers on various packaging technology related subjects and was granted 38 patents in Korea and 21 patents in the US. He holds a degree in Physics and a Masters of Statistical Physics from Korea University and a Masters of Solid State Physics and a Ph.D. in Theoretical Solid State Physics from Case Western Reserve University.