Wafer bumping technology can provide significant performance, form factor and cost advantages in a semiconductor package. Wafer bumping is an advanced manufacturing process whereby metal solder balls or bumps are formed on the semiconductor wafer prior to dicing. Wafer bumps provide an interconnection between the die and a substrate or printed circuit board in a device. Solder bump composition and dimension depends on a number of factors such as form factor, cost and the electrical, mechanical and thermal performance requirements of the semiconductor device.
STATS ChipPAC is experienced in a wide range of wafer bump alloys and processes,
including printed bump, ball drop and plated technology with eutectic, lead-free and copper pillar alloys. Our wafer bumping offering includes wafer bump and redistribution for 200mm and 300mm wafer sizes for full turnkey advanced flip chip and wafer level packaging solutions.