STATS ChipPAC’s world class design team has extensive experienced in the mobile, networking, computing, consumer and automotive markets. Their experience covers a wide range of arra
y, leadframe and wafer level package designs, including single die, multi-die, Package-on-Package (PoP), Integrated Passive Devices (IPD) and
advanced System-in-Package (SiP). STATS ChipPAC’s dedicated design team has the necessary experience to provide complex designs that meet or exceed assembly and cost targets.