Wirebonding remains one of the most widely adopted methods in semiconductor assembly, connecting chips to substrates, substrates to substrates, or substrates to packages. We offer a full range of wirebond solutions across QFN, DFN, QFP, WB-BGA, and WB-LGA formats — with materials including gold, copper, silver, and palladium-coated wire. Backed by high-volume manufacturing and billions of units shipped, our platforms serve power, memory, MEMS, mobile, automotive, and beyond.

Flip chip technology enables direct die-to-substrate connections through solder bumps — reducing parasitics, improving thermal efficiency, and shrinking form factors.

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We support a broad range of flip chip formats including fcCSP, fcBGA, C2W, and 3DIC. Applications span from large single-die packages with thermal enhancements to compact modules and AiP designs with embedded antennas.

Wafer bumping enables high-density interconnects directly at the wafer level. It supports improved electrical performance, tighter form factors, and lower overall cost.

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We provide bumping and redistribution services for 200mm and 300mm wafers, including redistribution and full turnkey support for flip chip and wafer-level packaging. Our process capabilities span printed bump, ball drop, and plated bumping with lead-free and copper pillar alloys—optimized for reliability and production scale.

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Wafer-level packaging integrates more functionality directly at the wafer stage, reducing size and improving power, speed, and signal integrity. It’s key to enabling next-gen devices that demand performance without compromising footprint or cost. 

System-in-Package (SiP) combines multiple chips and components into a single compact module, enabling faster processing, higher performance, and more functionality in less space.

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Our platforms support heterogeneous integration of logic, analog, power, and memory ICs using SMT, wirebond, and flip chip. Advanced technologies include:

• Dual-sided molding – reduces package size, shortens routing, lowers resistance, and improves system performance
• EMI shielding – enhances thermal conductivity and signal integrity via backside metallization
• Laser-assisted bonding (LAB) – overcomes traditional reflow issues like warpage, stress, and CTE mismatch for improved reliability

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MEMS and sensor packaging enables real-time sensing, responsiveness, and control in compact, power-efficient designs. These technologies are foundational across communications, automotive, medical, industrial, and consumer systems.

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Our dedicated MEMS team supports full turnkey development including packaging co-design, simulation, BOM qualification, assembly, testing, and quality assurance. We deliver highly integrated, size-optimized solutions that meet the performance and cost demands of modern sensing applications.

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Advanced 2.5D and 3D packaging stacks and interconnects multiple components to maximize functionality and performance.

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