The Importance of System Integration
Semiconductor companies are continually faced with complex integration challenges as consumers want their electronics to be smaller, faster and higher performance with more and more functionality packed into a single device. Semiconductor packaging has a significant impact on addressing these challenges. Current and future demands for greater system performance, increased functionality, reduced power consumption and reduced form factor require an advanced packaging approach known as system integration.
System integration is combining multiple integrated circuits (ICs) and components into a single system or modularized sub-system in order to achieve higher performance, functionality and processing speeds with a significant reduction in space requirements inside the electronics device.
What is System-in-Package?
System-in-Package (SiP) is a functional electronic system or sub-system that includes two or more heterogeneous semiconductor die (often from different technology nodes optimized for their individual functionalities), usually with passive components. The physical form of SiP is a module, and depending on the end application, the module could include a logic chip, memory, integrated passive devices (IPD), RF filters, sensors, heat sinks, antennas, connectors and/or power chip in packaged or bare die form.