Singapore – 16 January 2018 – STATS ChipPAC Pte. Ltd. (“STATS ChipPAC” or the “Company”), a leading provider of advanced semiconductor packaging and test services, announced today that it has been ranked among the world’s top 10 semiconductor equipment manufacturing companies in the 2017 Patent Power Scorecards published by the Institute of Electrical and Electronics Engineers (IEEE), the world’s largest professional association for the advancement of technology. This is the eighth consecutive year that STATS ChipPAC has been recognised in the annual scorecards.
The 2017 Patent Power Scorecards are based on an analysis of U.S. Patent and Trademark Office records through the end of 2016. The patent portfolios of more than 6,000 leading commercial enterprises, academic institutions, nonprofit organisations and government agencies worldwide were benchmarked by 1790 Analytics, an Intellectual Property (IP) evaluation firm. The scorecards rate the most valuable IP portfolios based on several factors including the size of an organisation’s patent portfolio, quality, impact, originality and general applicability.
STATS ChipPAC was ranked eighth in the Semiconductor Equipment Manufacturing category. With 1,667 patents issued by the U.S. Patent and Trademark Office (USPTO) through the end of 2016, STATS ChipPAC has continued to be the leading U.S. patent holder among Outsourced Semiconductor Assembly and Test (“OSAT”) providers worldwide. Over 65% of STATS ChipPAC’s IP is focused on advanced wafer level packaging, flip chip and system-in-package technology.
“Semiconductor packaging is a strategic enabler for our customers who are looking for complex, highly integrated solutions that satisfy their performance, size and cost requirements. Our continuous drive for innovation provides customers with the technology and manufacturing expertise they need to deliver new products in current and emerging markets,” said Shim Il Kwon, Chief Technology Officer, STATS ChipPAC. “With the combined IP portfolio of the JCET Group, we offer our customers a powerful competitive advantage in leading edge packaging technology.
Certain of the statements in this release, including statements regarding the Company’s intellectual property, are forward-looking statements that are based on management’s current views and assumptions and involve a number of risks and uncertainties which could cause actual events or results to differ materially from those described in this release. Factors that could cause actual results to differ include, but are not limited to, general business and economic conditions and the state of the semiconductor industry; prevailing market conditions; demand for end-use applications products such as communications equipment, consumer and multi-applications and personal computers; decisions by customers to discontinue outsourcing of test and packaging services; level of competition; our reliance on a small group of principal customers; our continued success in technological innovations; pricing pressures, including declines in average selling prices; intellectual property rights disputes and litigation; our ability to control operating expenses; our substantial level of indebtedness and access to credit markets; potential impairment charges; availability of financing; changes in our product mix; our capacity utilisation; delays in acquiring or installing new equipment; limitations imposed by our financing arrangements which may limit our ability to maintain and grow our business; returns from research and development investments; changes in customer order patterns; customer credit risks; disruption of our operations; shortages in supply of key components and disruption in supply chains; disruption of our operations and other difficulties related to the relocation of our China operations; loss of directors, key management or other personnel; defects or malfunctions in our testing equipment or packages; rescheduling or cancelling of customer orders; adverse tax and other financial consequences if the taxing authorities do not agree with our interpretation of the applicable tax laws; our ability to develop and protect our intellectual property; changes in environmental laws and regulations; exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; beneficial ownership by Jiangsu Changjiang Electronics Technology Co., Ltd. (“JCET”) of all of our ordinary shares that may result in conflicting interests with other holders of our securities; our inability to capture all or any of the benefits from acquisitions and investments in other companies and businesses or from the acquisition of us in August 2015 by JCET-SC (Singapore) Pte, Ltd., which is now wholly-owned by JCET; loss of customers or failure to compete effectively with our former Taiwan subsidiaries which we have divested in 2015; labour union problems in South Korea; uncertainties of conducting business in China and changes in laws, currency policy and political instability in other countries in Asia; natural calamities and disasters, including outbreaks of epidemics and communicable diseases; and other risks. All our forward looking statements are expressly qualified in their entirety by the cautionary statements set forth above. You should not unduly rely on such forward-looking statements, which speak only as of the date of this release. STATS ChipPAC does not intend, and does not assume any obligation to update any industry information or forward-looking statements to reflect subsequent events or circumstances. In light of these risks, uncertainties and assumptions, any of the events anticipated in these forward-looking statements might not occur.
About STATS ChipPAC Pte. Ltd.
STATS ChipPAC Pte. Ltd. is a leading service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing and customer support offices throughout Asia, the United States and Europe. STATS ChipPAC is a member of the JCET group of companies. Further information is available at www.statschippac.com or www.jcetglobal.com. Information contained in this website does not constitute a part of this release.
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