Test Development Services

Test Development Services

STATS ChipPAC provides customers with test development and test program migration services. Our capabilities include:

Design for Manufacturing (DFM) consultation
Test program development, debug and validation
Device characterization
First silicon characterization (wafer test)
Test program optimization including test time optimization
Probe card design, fabrication and qualification (wafer test)
Load board design, fabrication and qualification (final test)
Design, fabrication and qualification of any other interfacing hardware (final test)
Multi-site migration to higher parallel testing
Test program migration to a different test platform

Included with these services are any test program changes required to rapidly maximize and stabilize first pass yields for high volume production.

Test Development Flow

Additional Resources

Test Solutions Brochure

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