STATS ChipPAC offers several USB flash drive options within its family of solutions for removable solid-state storage (RS3) applications. STATS ChipPAC’s USB options utilize bare die level assembly, pre-packaged die assembly or a combination of both. The USB module is an example of an integrated solution using NAND and controller die, while the SD-USB is an example of a package that uses bare and pre-packaged die. A majority of our card packaging processes are common with traditional packaging and leverage the most up to date technologies and processes unique to memory cards, including integrated curve-cutting, labelling, mechanical card assembly and card packaging. The key to maximizing the full value of packaging integration in removable solid-state storage devices is to provide a complete solution of design, test development, advanced packaging, memory test, card assembly and card test. STATS ChipPAC stands out in the outsourced semiconductor assembly and test market because of our focus on full turnkey services.