STATS ChipPAC offers a variety of flash memory card formats in addition to value-added package assembly and test services. A majority of our card packaging processes are common with traditional packaging and leverage the most up-to-date technologies and processes unique to memory cards, including integrated curve-cutting, labelling, mechanical card assembly and card packaging. STATS ChipPAC provides solutions that utilize bare die level assembly, pre-packaged die assembly or a combination of both. The Micro-SD is an example of an integrated solution using NAND and controller die. In addition to assembly, STATS ChipPAC offers memory and card test services, with dedicated test resources to support test development as required.