Memory Devices

STATS ChipPAC offers a variety of memory card formats in addition to value-added package assembly and test services. A majority of our card packaging processes are common with traditional packaging and leverage the most up-to-date technologies and processes unique to memory cards, including integrated curve-cutting, labelling, mechanical card assembly and card packaging. STATS ChipPAC provides solutions that utilize bare die level assembly, pre-packaged die assembly or a combination of both. The Micro-SD is an example of an integrated solution using NAND and controller die while the SD-USB is an example of bare die, pre-packaged die and SMT components. In addition to assembly, STATS ChipPAC offers memory and card test services, with dedicated test resources to support test development as required.