Mold Flow

Mold compound is a key element of an IC package, thus the impact on IC reliability is significant. STATS ChipPAC’s moldflow analysis includes void prediction, wire sweeping and warpage simulation. To ensure the reliability of IC packages, the AutoCAD Moldflow and Moldex3D tools are used to predict the following physics.

STATS ChipPAC’s void prediction covers three different processes: (1) tradition capillary underfill, (2) the molded underfill (MUF), and (3) the compression molded underfill. For fine pitch flip chip bumping array, void generation can be a serious issue causing the short of the electrical connections and the cracking of the bumps. STATS ChipPAC’s characterization team focuses on the prediction of void generation before manufacturing. The early stage finite element analysis (FEM) numerical simulation not only can predict the risk of voids, but also provides the best economic approach without the need for trial and error during package development. The filling, packing and curing of the molding compound are considered to ensure the best IC reliability.

STATS ChipPAC’s void prediction covers three different processes: (1) tradition capillary underfill, (2) the molded underfill (MUF), and (3) the compression molded underfill. For fine pitch flip chip bumping array, void generation can be a serious issue causing the short of the electrical connections and the cracking of the bumps. STATS ChipPAC’s characterization team focuses on the prediction of void generation before manufacturing. The early stage finite element analysis (FEM) numerical simulation not only can predict the risk of voids, but also provides the best economic approach without the need for trial and error during package development. The filling, packing and curing of the molding compound are considered to ensure the best IC reliability.

STATS ChipPAC’s warpage of IC package is caused not only by differences in the material properties, but also by the processing factors or manufacturing procedures. Traditional mechanical simulation usually considers only the material properties and temperature excursion without considering the detailed chemical kinetics of mold compound during the manufacturing steps. STATS ChipPAC’s research and development (R&D) accounts for the in-line processing parameters, particularly the manufacturing and processing of the mold compound material to form the IC packages on a strip. The in-line manufacturing parameters, such as pressure, temperature, shrinkage, and processing timing, have to be carefully considered in order to accurately predict the warpage.