STATS ChipPAC’s STATS ChipPAC’s Quad Flat No-Lead Stand-off Terminal (QFNs-st) package features a significantly higher number of I/O terminal pads than traditional QFN packages. Whereas QFP and QFN packages require 0.4mm pitch to accommodate more I/O, QFNs-st can accommodate more I/O with a more relaxed terminal pitch by virtue of allowing multiple rows. QFNs-st has the flexibility to accommodate multiple rows of terminals with either fixed or variable pitch which, in turn, enables board routing for various applications, thereby extending the application and pin count range of this cost effective QFN type package. The QFNs-st is a leadframe based, plastic encapsulated, chip scale packaging solution in molded array format (saw singulated). An exposed die pad coupled with extremely low RLC provides excellent electrical and thermal performance enhancements, and is especially suited for wireless, handheld portable, computing and storage applications. QFNs-st is available in various body sizes and thicknesses, has a green/lead-free bill of materials and can be mounted by conventional SMT equipment. Board level reliability and drop test have been proven for both mobile and computing applications.