a low profile QFP, with thermally enhanced (LQFP-ep) and stacked options (LQFP-SD) available
At STATS ChipPAC, we provide a comprehensive range of leadframe package solutions–from standard leadframe packages to low profile, small and thin, thermally enhanced packages. STATS ChipPAC’s leadframe packages are available in a wide variety of body sizes, lead pitch, and are in standard and green / lead-free bill of materials. Additionally, STATS ChipPAC’s leadframe packages are assembled using industry proven materials and technologies to ensure long term performance and reliability.
Quad Flat Packages (QFP)
A QFP is a surface-mounted integrated circuit package with “gull wing” leads extending from each of the four sides. QFPs are used primarily for surface mount devices (SMDs). STATS ChipPAC’s comprehensive range of quad flat pack options includes:
Quad Flat No-Lead Packages (QFN)
QFN is available in a variety of JEDEC standard thicknesses, including “very thin” VQFP packages, “very, very thin” WQFNpackages, “ultra thin” UQFN packages and “extremely thin” XQFN packages.