STATS ChipPAC’s Plastic Ball Grid Array (PBGA) packages utilize laminate substrates and are available over a variety of standard JEDEC body sizes and ball counts to meet a wide range of customer requirements. This package provides a cost-effective advanced packaging solution, offering higher density over traditional leadframe packages.

STATS ChipPAC’s Plastic Ball Grid Array – Heat Spreader (PBGA-H) package is a cost-effective, thermally enhanced version of the PBGA package that features a formed, one piece heat spreader integrated into the mold cap and exposed at the PBGA package surface. This enables further board or system level thermal enhancement by the package end-user. The PBGA-H leverages STATS ChipPAC’s extensive portfolio of tooled PBGA body sizes and ball counts.

STATS ChipPAC’s Plastic Ball Grid Array – Multi-Die (PBGA-MD) package provides a cost-effective advanced packaging solution and is a direct extension of our single die product offerings to multi-die configurations. STATS ChipPAC’s PBGA-MD offerings support either side by side and/or stacked die configurations.

STATS ChipPAC’s chip stack technology offers the flexibility of stacking 2 to 7 die in a single package. The Stacked Die Plastic Ball Grid Array (PBGA-SD) package takes advantage of the proven high electrical and thermal performance of STATS ChipPAC’s PBGA packages, with efficient use of space made possible through die stacking technology.

STATS ChipPAC’s advanced design and simulation capabilities enable package optimizations needed for maximum electrical and thermal performance. STATS ChipPAC combines state of the art processing and equipment with proven material sets to achieve enhanced yield, reliability, and performance. Green and lead-free material sets are available for all PBGA package types.