STATS ChipPAC’s Fine Pitch Ball Grid Array (FBGA) is a laminate substrate-based chip scale package with plastic overmolded encapsulation and an array of fine pitch solder ball terminals. The FBGA package’s reduced outline and thickness and higher density options make it an ideal advanced technology packaging solution for high performance and/or portable applications. The use of the latest materials and advanced assembly infrastructure produce a reliable and cost effective package. Lead free and halogen free compatible material sets are available. STATS ChipPAC’s FBGA is available in a broad range of JEDEC standard body sizes with LFBGA (less-than 1.70mm [typically less-than 1.40mm]), TFBGA (less-than 1.20mm), VFBGA (less-than 1.00mm), WFBGA (less-than 0.80mm), UFBGA (0.65mm max.) and XFBGA (0.50mm max.) thickness.

STATS ChipPAC’s FBGA offering also includes stacked die options (FBGA-SD), including LFBGA-SD, TFBGA-SD, VFBGA-SD, WFBGA-SD and UFBGA-SD packages. STATS ChipPAC’s chip stack technology offers the flexibility of stacking 2 to 7 die in a single package. Die to die bonding capability enables device and signal integration to improve electrical performance and reduce overall package I/O requirements. Wafer thinning technology, overhang wire bond technology and the use of spacers between stacked die provide the flexibility to stack almost any desirable configuration of die in one package. This capability uses existing assembly infrastructure, which results in more functional integration with lower overall package cost. The use of the latest packaging materials allows this package to meet JEDEC Moisture Resistance Test Level 2a with lead-free reflow conditions. This is an ideal package for integrating memory for mobile phones. It is also used to integrate logic and memory, logic and analog, or combinations of memory, logic, analog and RF.