STATS ChipPAC’s FBGA offering also includes stacked die options (FBGA-SD), including LFBGA-SD, TFBGA-SD, VFBGA-SD, WFBGA-SD and UFBGA-SD packages. STATS ChipPAC’s chip stack technology offers the flexibility of stacking 2 to 7 die in a single package. Die to die bonding capability enables device and signal integration to improve electrical performance and reduce overall package I/O requirements. Wafer thinning technology, overhang wire bond technology and the use of spacers between stacked die provide the flexibility to stack almost any desirable configuration of die in one package. This capability uses existing assembly infrastructure, which results in more functional integration with lower overall package cost. The use of the latest packaging materials allows this package to meet JEDEC Moisture Resistance Test Level 2a with lead-free reflow conditions. This is an ideal package for integrating memory for mobile phones. It is also used to integrate logic and memory, logic and analog, or combinations of memory, logic, analog and RF.