the Fine Pitch Ball Grid Array package is a laminate substrate-based chip scale package with plastic overmolded encapsulation and an array of fine pitch solder ball terminals. FBGA is also available in stacked configurations (FBGA-SD).
BGA technology was first introduced as a solution to problems associated with the increasingly high lead counts required for advanced semiconductors used in applications such as portable consumer devices and wireless telecommunications. As the number of leads surrounding the integrated circuits increased, high lead count packages experienced significant electrical shorting problems. BGA technology solved this problem by effectively creating and array of leads on the bottom surface of the package in the form of small bumps or solder balls.
STATS ChipPAC offers a comprehensive range of laminate-based BGA packaging options:
STATS ChipPAC’s laminate packages are available in a variety of JEDEC standard thicknesses, including: