Copper wire is increasingly becoming the material of choice for interconnection in wirebond packages. While copper has been used in the industry as an interconnect material for many years, recent increases in the price of gold wire have driven a rapid shift away from gold to copper as an attractive alternative to achieve significant package cost savings. Copper wire provides similar electrical characteristics and performance to gold wire, however, it also offers lower resistivity which can be a benefit where lower bond wire resistance is needed for device performance.
Palladium-Coated Copper Wire
Palladium-coated copper wire (Pd-Cu) recommended for all applications, fab nodes and development programs
Copper Wirebond Considerations
Consult STATS ChipPAC for a review of your design for copper wirebond readiness.
Broad Portfolio of Copper (Cu) Wirebond Packages
STATS ChipPAC offers copper wirebond solutions in a wide range of leaded and laminate packages across all its manufacturing sites. The following package types are available with copper (Cu) wire, are fully qualified and ready for production:
Refer to the Copper (Cu) Wirebond datasheet for complete details of STATS ChipPAC’s copper wirebond capabilities.
Full Turnkey Wirebond Services
STATS ChipPAC is uniquely positioned to provide full turnkey processing to our customers. STATS ChipPAC offers full turnkey wirebond services ranging from design through production, including high speed, high pin count digital and RF testing.