Wire bond interconnection is available in a number of packaging approaches at STATS ChipPAC:
Leaded packages are characterized by a die encapsulated in a plastic mold compound with metal leads surrounding the perimeter of the package. This simple and low-cost packaging is still the best solution for many applications. STATS ChipPAC provides a comprehensive range of leadframe package solutions from standard leadframe packages to low profile, small and thin, thermally enhanced packages, including quad flat packages (QFP), quad / dual flat no-lead packages (QFN / DFN) and thin, small outline profile packages (TSOP).
We collaborate with customers on die and package designs to provide the best possible products in terms of performance, quality, cycle time and cost. STATS ChipPAC’s full-service package Design Centers help customers determine the optimum package for complex integrated circuits, and can assist customers in designing the most appropriate package for their specific device.