A Pioneer in TSV Technology
STATS ChipPAC’s TSV capabilities also include 300mm mid-end of line (MEOL) processing capabilities in areas such as TSV formation and metallization, bumped wafer thinning, thin wafer handling, 3D microbump bonding, wafer-level underfill and TSV assembly. State of the art process equipment and metrology tools were installed and qualified as part of a high volume manufacturing expansion of 300mm wafer capability, bringing TSV into volume production mode. Additional expansion in 2012 is further increasing volume and quality levels of all advanced wafer scale products including TSV.
TSV is an important developing technology that utilises short, vertical electrical connections or “vias” that pass through a silicon wafer in order to establish an electrical connection from the active side to the backside of the die, thus providing the shortest interconnect path and creating an avenue for the ultimate in 3D integration. TSV technology offers greater space efficiencies and higher interconnect densities than wire bonding and flip chip stacking. When combined with microbump bonding and advanced flip chip technology, TSV technology enables a higher level of functional integration and performance in a smaller form factor.
STATS ChipPAC TSV Capabilities
TSV Mid-End Process (MEOL)
TSV Assembly/Packaging (BEOL)
TSV Silicon Interposer Technology
TSV Assembly / Packaging (BEOL)
TSV Assembly Packaging Options
TSV Mid-end Fabrication (MEOL)
TSV Interposer and Assembly
TSV Technology Integration
TSV in IPD
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