Advantages of eWLCSP include:
A Robust WLP Technology: eWLCSP
eWLCSP offers significant structural advantages over traditional WLCSP designs. As a bare die package, WLCSP is regularly exposed to potential cracking, chipping and handling issues that can occur before or during the SMT assembly process. This is particularly true for advanced node products where the die is very thin and dielectric layers are extremely fragile. eWLCSP is equivalent to a conventional WLCSP product with the addition of a thin protective coating on the backside and four sidewalls of the die, achieving increased durability and reliability within the standard WLCSP size specification.
Encapsulation offers a variety of advantages:
Ease of Conversion, Lower Costs
Customers can seamlessly transition from standard WLCSP to an eWLCSP design or a fan-out design within the same basic package platform. A product currently using a conventional WLCSP process can be converted to eWLCSP without a silicon design change, regardless of the current silicon wafer diameter. 300mm devices transitioning to advanced silicon nodes with fragile dielectric layers will especially benefit from conversion to eWLCSP. The FlexLine method can reduce WLCSP costs by 15-30% when using the optimum design requirements for WLCSP devices; e.g., 200mm incoming wafers can be reconstituted into 300mm or larger carrier sizes, providing customers with the advantage of size scaling. Further per-unit cost reductions are achieved as the carrier size increases.
eWLCSP Market Applications & Drivers
eWLCSP is a compelling solution for space constrained mobile devices and new applications such as wearable technology and automotive applications.