Advantages of FOWLP, also known as embedded Wafer Level Ball Grid Array (eWLB), technology include:
The Most Comprehensive Fan-Out Portfolio in the Industry
An early industry adopter in 2008, STATS ChipPAC set an aggressive course in pushing the boundaries and developing advanced fan-out technology and manufacturing capabilities long before its peers. STATS ChipPAC has driven a number of eWLB technology achievements such as dense vertical interconnections as high as 500 – 1,000 I/O, very fine line and widths spacing down to 2um/2um and ultra thin package profiles below 0.3mm (including solderball) for single packages and below 0.8mm for stacked packages with proven warpage control.
Our comprehensive Fan-out portfolios includes:
The compelling performance, size and cost advantages of eWLB are accelerating the adoption of this advanced technology into new markets such as the Internet of Things (IoT) and wearable electronics, Micro-ElectroMechanical Systems (MEMS) and sensors, and automotive applications.
Fan-out eWLB Advantages
eWLB technology provides significant performance, size and cost advantages, compared to other technology available today: