STATS ChipPAC provides the highest level integration of wireless systems. With leading edge technology in Chip Scale Module Package (CSMP), IPD, 3D packaging and a comprehensive RF solutions portfolio, including wafer sort, design, assembly, RF test and supply chain management, STATS ChipPAC offers RF semiconductor companies a complete turnkey solution and distinct competitive advantage in their markets.
IPD Products Databook, 2nd edition
STATS ChipPAC offers a library of standard IPDs, which can be very efficiently used in RF SiP products, along with ICs made from other technologies. Both wirebonding and flip chip version IPDs are available from our process. Custom designs can also be made to optimize performance for specific packages, such as QFN, LFBGA and FLGA. Library elements are now available for low pass filters (LPF), band pass filters (BPF), baluns and diplexers at various frequencies, as shown in this databook.
Download entire databook or choose an individual section by product type below.
- Part NumberDescriptionDownload
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