single die, multi-die and stacked Package-on-Package configurations
The Importance of System Integration
Semiconductor companies are continually faced with complex integration challenges as consumers want their electronics to be smaller, faster and higher performance with more and more functionality packed into a single device. Semiconductor packaging has a significant impact on addressing these challenges. Current and future demands for greater system performance, increased functionality, reduced power consumption and reduced form factor require an advanced packaging approach known as system integration.
System integration is combining multiple integrated circuits (ICs) and components into a single system or modularized sub-system in order to achieve higher performance, functionality and processing speeds with a significant reduction in space requirements inside the electronics device.
What is System-in-Package?
Advantages of Advanced SiP
Today, advanced SiP and miniaturized modules are being utilized in a number of markets such as mobile devices, Internet of Things (IoT), wearables, healthcare, industrial, automotive, computing and communication networks. Each advanced SiP solution varies in complexity based on the number and functionality of the components required by each application.
Following are examples of advanced SiP applications:
Depending on the application requirements and product complexity, there are advanced SiP configurations ranging from conventional 2D modules with multiple active and passive components, interconnected through flip chip, wire bonding and SMT to more complex modules such as Package-in-Package (PiP), Package-on-Package (PoP), 2.5D and 3D integrated solutions. The advanced SiP module configurations (2D/2.5D/3D) are customized for specific end applications to leverage a variety of potential benefits including performance, cost, form factor, and Time-to-Market (TTM).