STATS ChipPAC’s standard fcCSP packages offering includes very thin profile packages (fcTCSP, fcVCSP, fcWCSP and fcUCSP), as well as side-by-side die configurations. All fcCSP packages are produced on substrates with matrix strip format and use overmolding and saw singulation processes similar to wirebond packages of the same form factors. The fcCSP is an overmolded package with solder balls, and is available in a high thermal performance package (fcCSP-H) produced on substrates in matrix strip format with heat spreader.
fcFBGA packages are also available in very thin profile hybrid flip chip (flip chip on the bottom and wirebond die on the top) such as fcTCSP-SD2 andfcTCSP-SD3. Hybrid fcCSP packages are available with Mass Reflow (MR), CUF or MUF, and copper (Cu) pillar and Cu wire.
STATS ChipPAC’s fcFBGA offering also includes package-on-package (PoP) solutions in Bare Die and Molded Laser formats. Both fcPoP formats are offered as the bottom PoP package (PoPb) of a stackable flip chip BGA. PoPb is typically an application processor or an integrated baseband device with land pads placed on the top periphery of the package surface to enable the stacking of a second FBGA or PoP top (PoPt) above. Bare Die PoP differs from fcBGA through the inclusion of memory interface (MI) pads on the substrate top side. Molded Laser PoP (MLP) offers aggressive package height reductions or 0.35mm MI pitch, and, with its overmold configuration, provides better warpage performance. MLP-PoP is also offered with an exposed die (PoP-MLP-ED) which reduces mold cap height and improved warpage performance.
STATS ChipPAC offers a complete fcFBGA portfolio of high to low-end packages for all mobile applications: