Flip Chip Ball Grid Array (fcBGA)
Flip Chip Ball Grid Array packages (fcBGA) form a subgroup of the Flip Chip package family. The fcBGA package is the main platform in this sub-group, which also includes bare die, stiffener only and a thermally enhanced version with one/two piece heat spreader or lid (fcBGA-H), System-in-Package (fcBGA-SiP) versions and a package subsystem meeting the standard BGA footprint that contains multiple components within the same package (fcBGA-MPM). Options also include configurations with thin core, Pb-free and copper column bumps. STATS ChipPAC’s Flip Chip BGA packages are available in ball counts ranging from 220 to 3000+, body sizes from 12 x 12mm to 55 x 55mm.
STATS ChipPAC offers a complete fcBGA portfolio for the network, computing and consumer markets. Demand for greater functionality and significantly higher processing speeds in consumer and networking devices is driving flip chip technology to provide cost effective, scalable packages with ultra low K dielectrics, high power integrity, superior thermal performance and higher resistance to electromigration (EM) in very large package sizes, with very fine bump pitches and lead-free solder.
STATS ChipPAC offers a complete fcBGA portfolio for the network, computing and consumer markets. Demand for greater functionality and significantly higher processing speeds in consumer and networking devices is driving flip chip technology to provide cost effective, scalable packages with ultra low K dielectrics, high power integrity, superior thermal performance and higher resistance to electromigration (EM) in very large package sizes, with very fine bump pitches and lead-free solder.
Features
Applications
STATS ChipPAC offers a complete fcBGA portfolio of high to low-end packages for the Network, Computing and Consumer markets.
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